A Survey of 3D Circuit Integration
نویسنده
چکیده
This paper surveys recent publications on the new class of layered circuit integration techniques termed 3D integration. We describe both the potential benefits and major pitfalls of 3D integration. Several competing layering approaches are described and compared. We also forecast the impact that a move to 3D integration would have on CAD tools and circuit design flows.
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تاریخ انتشار 2008